English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Hauptwerk
International Conference on Electronic Packaging Technology & High Density Packaging. ICEPT-HDP 2008
Details
Publications
Statistics
Options
Show all metadata (technical view)
Title
International Conference on Electronic Packaging Technology & High Density Packaging. ICEPT-HDP 2008
Publisher
IEEE Service Center
Publishing Place
Piscataway, NJ
Publication Date
2008
ISBN
978-1-4244-2740-6
978-1-4244-2739-0
Conference
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) 2008
