Title

IEEE 22nd International Symposium for Design and Technology in Electronic Packaging, SIITME 2016

Title Supplement

20th-23rd of October 2016, Oradea, Romania; Proceedings

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2016

ISBN

978-1-5090-4445-0

978-1-5090-4446-7

Conference