Title

11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems, EuroSimE 2010

Title Supplement

Bordeaux / France; 26.-28.04.2010

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2010

ISBN

978-1-4244-7026-6

978-1-4244-7027-3

Conference