Title

IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.1

Title Supplement

27 - 30 May 2014, Lake Buena Vista (Orlando), FL, USA

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-5268-7

978-1-4799-5267-0

Conference