Title

DTIP 2016, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Title Supplement

Budapest, Hungary, May 30th - June, 2, 2016

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2016

ISBN

978-1-5090-1391-3

978-1-5090-1457-6

978-1-5090-1458-3

Conference