Title

29th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2023

Title Supplement
Budapest, Hungary, 27-29 September 2023
Editor(s)
Poppe, András
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
Publisher
Publication Date
2023
ISBN
979-8-3503-1863-0
979-8-3503-1862-3
DOI
Conference
Acronym
THERMINIC
Language
English