Title

15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Titel Supplements
7-9 April 2014, Ghent , Belgium
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
Verlagsort
Piscataway, NJ
Datum
2014
ISBN
978-1-4799-4791-1
978-1-4799-4790-4
Konferenz