Title

15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014

Title Supplement

7-9 April 2014, Ghent , Belgium

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-4791-1

978-1-4799-4790-4

Conference