Title

Advances in electronic packaging 2003. Vol.2

Title Supplement

Presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6 - 11, 2003, Maui, Hawaii. InterPACK '03, IPACK 03

Corporate Author

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division

Publisher

Publishing Place

New York, NY

Publication Date

2003

ISBN

0-7918-3691-6

Conference