Options
Title
THERMINIC 2009, 15th International Workshop on Thermal Investigations of ICs and Systems
Title Supplement
Leuven, Belgium, 7 - 9 October 2009
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Circuits Multi-Projets -CMP-, Grenoble
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher
Publishing Place
New York, NY
Publication Date
2010
ISBN
978-1-4244-5881-3
978-2-35500-010-2