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18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
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Title
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Titel Supplements
3-5 April 2017, Dresden
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Fraunhofer-Institut für Keramische Technologien und Systeme -IKTS-, Dresden
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2017
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2017