Title

ISTFA 2017, 43rd International Symposium for Testing and Failure Analysis. Conference Proceedings

Title Supplement

November 5-9, 2017, Pasadena Convention Center, Pasadena, California, USA

Corporate Author

ASM International

Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio

Publisher

Publishing Place

Materials Park, Ohio

Publication Date

2017

ISBN

978-1-62708-150-4

1-62708-150-X

978-1-62708-151-1

1-62708-151-8

Conference