Processing, Materials, and Integration of Damascene and 3D Interconnects
Titel Supplements
Papers originally presented in the Symposium "Processing, Materials and Integration of Damascene and 3D Interconnects", held during the 216th meeting of the Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009
Institut
Electrochemical Society -ECS-, Dielectric Science and Technology Division