Title

International Wafer Level Packaging Conference, IWLPC 2018

Title Supplement

San Jose, CA, USA, October 23-25, 2018

Corporate Author

Surface Mount Technology Association -SMTA-

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-1-944543-06-8

978-1-5386-9308-7

Conference