Title

IEEE Technology and Engineering Management Conference, TEMSCON 2018
Titel Supplements
28 June - 1 July 2018, Evanston, Illinois, USA
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
Verlagsort
Piscataway, NJ
Datum
2018
ISBN
978-1-5386-2047-2
978-1-5386-2046-5
978-1-5386-2048-9
Konferenz