Title

IEEE Technology and Engineering Management Conference, TEMSCON 2018

Title Supplement

28 June - 1 July 2018, Evanston, Illinois, USA

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-1-5386-2047-2

978-1-5386-2046-5

978-1-5386-2048-9

Conference