English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Hauptwerk
International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2007
Information
Publications
Export
Statistics
Options
Title
International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2007
Titel Supplements
London, United Kingdom, 15 - 18 April 2007
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE Service Center
Verlagsort
Piscataway, NJ
Datum
2007
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2007