Title

International Conference on Electronics Packaging, ICEP 2017

Title Supplement

Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-4-9902188-3-6

978-4-9902188-2-9

978-1-5090-4888-5

Conference