Title

International Conference on Electronics Packaging, ICEP 2017
Titel Supplements
Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017
Institut
Institute of Electrical and Electronics Engineers -IEEE-
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
Verlagsort
Piscataway, NJ
Datum
2017
ISBN
978-4-9902188-3-6
978-4-9902188-2-9
978-1-5090-4888-5
Konferenz