Title

23rd IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2017. Compliant Proceedings

Title Supplement

26th-29th of October 2017, Constanta, Romania

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Institute of Electrical and Electronics Engineers -IEEE-, Romania Section

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-1-5386-1626-0

978-1-5386-1625-3

978-1-5386-1627-7

Conference