Title

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2014. Proceedings

Title Supplement

Yokohama, Japan, 9 - 11 September 2014

Corporate Author

Japan Society of Applied Physics -JSAP-

IEEE Electron Devices Society

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-5288-5

978-1-4799-5289-2

978-1-4799-5287-8

Conference