Title

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2017

Title Supplement

7-9 September 2017, Kamakura, Japan

Corporate Author

Japan Society of Applied Physics -JSAP-

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Electron Devices Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-4-86348-610-2

978-4-86348-611-9

978-4-86348-612-6

978-1-5386-0372-7

Conference