Title

22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Titel Supplements
April 19-20-21-22, 2021, Virtual Conference
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
Verlagsort
Piscataway, NJ
Datum
2021
ISBN
978-1-6654-1374-9
978-1-6654-1373-2
Konferenz