Title

25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

Title Supplement
07-10 April 2024, Catania, Italy
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
Publisher
Publication Date
2024
ISBN
979-8-3503-9364-4
979-8-3503-9363-7
DOI
Conference
Acronym
EuroSimE
Language
English