Title

IEEE CPMT Symposium Japan, ICSJ 2014

Title Supplement

"Packaging for future optoelectronics, RF/hig-speed electronics and bioelectronics", 4-6 November 2014, Kyoto

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-6194-8

978-1-4799-6195-5

Conference