Title

Thermal and mechanical simulation and experiments in microelectronics and microsystems. EuroSimE 2004

Title Supplement
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, May 10 - 12, 2004, Novotel Tour Noire, Brussels, Belgium
Person Involved
Corporate Author
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2004
ISBN
0-7803-8420-2
0-7803-8421-0
Conference