Title

23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)

Title Supplement
St Julian, Malta, 25 - 27 April 2022
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
Publisher
IEEE
Publication Date
2022
ISBN
978-1-6654-5837-5
978-1-6654-5836-8
Conference
Acronym