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23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)
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Title
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)
Titel Supplements
St Julian, Malta, 25 - 27 April 2022
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Datum
2022
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 2022
