Title

IEEE International 3D Systems Integration Conference, 3DIC 2019

Title Supplement
October 8-10, 2019, Sendai, Japan
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2019
ISBN
978-1-7281-4871-7
978-1-7281-4870-0
Conference