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  4. Stress Induced Phenomena and Reliability in 3D Microelectronics
 
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Title

Stress Induced Phenomena and Reliability in 3D Microelectronics

Title Supplement
28-30 May 2012, Kyoto, Japan
Person Involved
Corporate Author
American Institute of Physics -AIP-, New York
Publisher
AIP Press  
Publishing Place
New York, N.Y.
Publication Date
2014
Series
AIP Conference Proceedings; 1601
ISBN
978-0-7354-1235-4
Conference
International Workshop on Stress-Induced Phenomena in Microelectronics 2012  
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