English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Projekt
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line
Export
Statistics
Options
Show all metadata (technical view)
APECS-PL
Details
Results
Project Title
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line
Project Web Site
https://cordis.europa.eu/project/id/101183307
Loading...
Loading...
Start Date
November 1, 2024
End Date
June 30, 2029
Funding Program
HORIZON.2.4
Funder
European Commission