Title

International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026

Title Supplement

14-18 April 2026, Hiroshima, Japan

Corporate Author

IEEE Electronics Packaging Society

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publication Date

2026

ISBN

979-8-3195-0588-0

978-4-9914835-1-6

DOI

10.23919/ICEP-HBS69241.2026

Conference

International Conference on Electronics Packaging 2026

Hybrid Bonding Symposium 2026

Acronym

ICEP

HBS

Language

English