Title

22nd European Microelectronics and Packaging Conference & Exhibition, EMPC 2019. Technical papers

Title Supplement

16-19 September 2019, Pisa, Italy

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2019

ISBN

978-1-7281-6291-1

978-0-9568086-6-0

978-0-9568086-5-3

Conference