Title

18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. Proceedings

Title Supplement

May 28 - 31, 2019, Las Vegas, Nevada, USA

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Electronics Packaging Society -IEPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2019

ISBN

978-1-72812-461-2

978-1-72812-460-5

978-1-72812-462-9

Conference