Title

THERMINIC 2017, 23rd International Workshop Thermal Investigations of ICs and Systems

Title Supplement

September 27-29, 2017, Amsterdam, the Netherlands; Proceedings

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-1-5386-1928-5

978-1-5386-1929-2

Conference