Title

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2017. Proceedings

Title Supplement

Presented at ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, August 29-September 1, 2017, San Francisco, California, USA

Corporate Author

American Society of Mechanical Engineers -ASME-

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division

Publisher

ASME

Publishing Place

New York/NY.

Publication Date

2017

ISBN

978-0-7918-5809-7

Conference

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2017

Options

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2017. Proceedings