Title

IEEE Far East Forum on Nondestructive Evaluation/Testing, FENDT 2014. Proceedings

Title Supplement

20 Jun - 23 Jun 2014, Sichuan Province Chengdu, China

Corporate Author

Beijing Institute of Technology

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-4731-7

Conference