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  4. 18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013
 
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Title

18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013

Title Supplement
3rd - 5th September 2013, Glasgow, Scotland
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Univ. Glasgow
Publisher
IEEE  
Publishing Place
Piscataway, NJ
Publication Date
2013
ISBN
978-1-4673-5733-3
978-1-4673-5736-4
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2013  
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