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Photonic Integrated Circuits Assembly and Packaging Pilot Line
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PIXAPP
Details
Project Partner
SIGNED
Project Title
Photonic Integrated Circuits Assembly and Packaging Pilot Line
OpenAIRE ID
731954
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Start Date
January 1, 2017
End Date
September 30, 2021
Framework Progam
H2020
Funding Program
ICT-29-2016
