Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    A Novel Quantitative Adhesion Measurement Method for Thin Polymer and Metal Layers for Microelectronic Applications
    ( 2022)
    Woehrmann, Markus
    ;
    Mackowiak, Piotr
    ;
    Schiffer, Michael
    ;
    Lang, K.-D.
    ;
    Schneider-Ramelow, M.
    Advancements in packaging technologies like Fan-Out demand for a higher integration density with an increased number of RDL layers as well as novel low-k layers as interlayer dielectric. The adhesion of these layers becomes an important factor for the reliability of the packaging because an enforcement by mechanical bond is limited. This work presents a novel test method (Stripe Lift-Off Test - SLT) for the adhesion characterization of thin film layers used in RDL for Fan-In and Fan-Out. The method is based on a modified edge lift-off test (mELT) concept. A polymer layer under high tensile stress is used to force a delamination of a layer stack. A critical energy release rate (J/m2) leading to a delamination can be estimated based on the known biaxial stress in the stressing polymer. The usage of residual stress in a layer stack for driving a delamination avoids any additional clamping, gluing of additional layers or the demand of special adhesion measurement equipment. The quantified adhesion test can be integrated in any RDL production line since only coating equipment is needed as well as a dicing tool for sample generation. The sample generation complexity can be scaled regarding the purpose of the adhesion measurement - ranging from a quick, rough estimation and adhesion value evaluation in a production process to a precise prediction of the energy release rate that can be used as a basis for packaging simulation. The established mELT for the quantification of the interface's fracture toughness is limited by the fact that it is running at negative temperatures. The novelty of the SLT is a stress polymer layer with a modifiable stress state which allows the adhesion measurement at room temperature. The stress state can be tailored to investigate the delamination at a certain temperature related to the application. FE-modeling of the SLT in ANSYS is presented and these results are compared to the analytical energy release rate estimation of the SLT. These verified FEM fracture models form the basics for the integration of the SLT fracture toughness data into more complex reliability simulations of advanced packaging. Exemplary adhesion measurements are presented for polymer films as well as for sputter layers with different preconditioning.