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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
Interconnecting embroidered hybrid conductive yarns by ultrasonic plastic welding for e-textiles
Low-Temperature Processible Highly Conducting Pastes for Printed Electronics Applications
Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE
High-k dielectric screen-printed inks for mechanical energy harvesting devices