Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    XR-RF Imaging Enabled by Software-Defined Metasurfaces and Machine Learning: Foundational Vision, Technologies and Challenges
    ( 2022)
    Liaskos, Christos K.
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    Tsioliaridou, Ageliki N.
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    Georgopoulos, Konstantinos
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    Morianos, Ioannis
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    Ioannidis, Sotiris
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    Salem, Iosif
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    Manessis, Dionyssios
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    Schmid, Stefan
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    Tyrovolas, Dimitrios
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    Tegos, Sotiris A.
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    Mekikis, Prodromos Vasileios
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    Diamantoulakis, Panagiotis D.
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    Pitilakis, Alexandros K.
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    Kantartzis, Nikolaos V.
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    Karagiannidis, George K.
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    Tasolamprou, Anna C.
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    Tsilipakos, Odysseas
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    Kafesaki, Maria
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    Akyìldìz, Ian Fuat
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    Pitsillides, Andreas
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    Pateraki, Maria
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    Vakalellis, Michael
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    Spais, Ilias
    In this work, we present a new approach to Extended Reality (XR), denoted as iCOPYWAVES, which seeks to offer naturally low-latency operation and cost effectiveness, overcoming the critical scalability issues faced by existing solutions. Specifically, iCOPYWAVES is enabled by emerging PWEs, a recently proposed technology in wireless communications. Empowered by intelligent metasurfaces, PWEs transform the wave propagation phenomenon into a software-defined process. To this end, we leverage PWEs to: i) create, and then ii) selectively copy the scattered RF wavefront of an object from one location in space to another, where a machine learning module, accelerated by FPGAs, translates it to visual input for an XR headset using PWE-driven, RF imaging principles (XR-RF). This makes an XR system whose operation is bounded in the physical-layer and, hence, has the prospects for minimal end-to-end latency. For the case of large distances, RF-to-fiber/fiber-to-RF is employed to provide intermediate connectivity. The paper provides a tutorial on the iCOPYWAVES system architecture and workflow. Finally, a proof-of-concept implementation via simulations is provided, demonstrating the reconstruction of challenging objects in iCOPYWAVES-produced computer graphics.
  • Publication
    Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles
    ( 2022)
    Hölck, Ole
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    Vernhes, Pierre
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    Gamba, Baptiste
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    Cruz, Rodolfo
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    Huber, Saskia
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    Braun, Tanja
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    Schneider-Ramelow, Martin
    In this work, the warpage of a panel in the context of fan-out packaging is analysed. On a panel size of 300 × 300 mm2 a die layout is molded and debonded from the temporary carrier. The resulting warpage is characterised temperature dependent using the Projection Moiré technique globally across the complete panel and locally on the scale of few dies. Globally, results are analysed with respect to the shape change of the warpage and residual warpage after thermal cycling. Locally the curvature of single dies is compared to the global curvature of the tunnel shaped warpage. This work is part of the investigations with the aim to describe and control the warpage effects in Fan-Out Panel Level Packaging.