Options
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Now showing
1 - 10 of 61
-
PublicationEUCEMAN - recent activities from the European Center for Microreliability and Nanoreliability( 2009)
;Michel, B.Winkler, T. -
PublicationPackage Induced Stress Simulation and Experimental Verification( 2008)
;Schindler-Saefkow, F. ;Wittler, O. ;Kittel, H.Michel, B. -
PublicationExperimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography( 2008)
;Schacht, R. ;May, D. ;Kreyßig, K. ;Wittler, O. ;Wunderle, B.Michel, B. -
PublicationNumerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology( 2008)
;Sommer, J.-P. ;Noack, E. ;Michel, B.Becker, K.-F. -
PublicationThrough silicon via technology - processes and reliability for wafer-level 3D system integration( 2008)
;Ramm, P. ;Wolf, M.J. ;Klumpp, A. ;Wieland, R. ;Wunderle, B. ;Michel, B.Reichl, H.3D integration is a rapidly growing topic in the semiconductor industry that encompasses different types of technologies. The paper addresses one of the most promising technologies which uses through silicon vias (TSV) for interconnecting stacked devices on wafer-level to perform high density interconnects with a good electrical performance at the smallest form factor for 3D architectures. Fraunhofer IZM developed a post frontend 3D integration process, the so-called ICV-SLID technology based on metal bonding using solid-liquid-interdiffusion (SLID) soldering. The SLID metal system provides the mechanical and the electrical connection, both in one single step. The ICV-SLID fabrication process is well suited for the cost-effective production of both, high-performance applications (e.g. 3D microprocessor) and highly miniaturized multi-functional systems. The latter preferably in combination with wafer-level die stacking, as e.g. Thin Chip Integration (TCI) or SnAg-microbu mp technologies. The fabrication of distributed wireless sensor systems (e. g. e-CUBES®) is a typical example for the need of such mixed approaches. -
PublicationStudy of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages( 2008)
;Shirangi, H. ;Müller, W.H.Michel, B. -
PublicationInvestigations of Reliability of Lead-Free Solder Joints( 2008)
;Faust, W. ;Poller, T. ;Dudek, R.Michel, B. -
PublicationReliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings( 2008)
;Dudek, R. ;Ratchev, R. ;Faust, W.Michel, B. -
PublicationVibration, Deformation and Reliability - an Overview about Measuring Techniques( 2008)
;Rümmler, N. ;Schnitzer, R.Michel, B. -
PublicationIncorporating Advanced Fatigue and Fracture Mechanics Based Failure Analysis into Design-Optimization of Electronics Components( 2008)
;Auersperg, J.Michel, B.