Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Innovation Driver of the Next Decade: Technology Follows Application
    ( 2012)
    Lang, K.-D.
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    Pötter, H.
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    Aschenbrenner, R.
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    Becker, K.-F.
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    Boettcher, L.
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    Ehrmann, O.
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    Wilke, M.
    ;
    Toepper, M.
  • Publication
    Heterogeneous Integration
    ( 2009)
    Reichl, H.
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    Aschenbrenner, R.
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    Töpper, M.
    ;
    Pötter, H.
    The future of electronics will be smart innovative systems linked into networks, which will be used in a large variety of applications. They will contain electrical and non electrical functions. Heterogeneous Integration has to provide technologies to integrate such functions into one system. For the fabrication of heterogeneous systems, new architectures and system integration technologies are necessary, which have to ensure the realization of reliable systems at minimal sizes and at low production costs. Adequate interfaces for different application environments have to be created. The following characteristics of future hetero system integration describe the challenge for the European Industry: - integrated on-chip off-chip design as well as system partitioning/modularization - highly reliable systems - integration of electrical and non-electrical components - integrated wireless communication - integrated power conversion and storage - integration of different functions in one module/ package - application of ?add on? technologies to increase system functionality - ultra high dense component integration - short time to market processes and low cost solutions
  • Publication
    More than moore, hetero system integration and smart system integration
    ( 2008)
    Reichl, H.
    ;
    Aschenbrenner, R.
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    Pötter, H.
    ;
    Schmitz, S.
    Sensor Networks open up new possibilities for measurement and control systems as well as for logistics. A broad application area of theses systems are the industrial environment of monitoring systems varying from monitoring environmental parameters, steering of logistic systems to technical diagnostics in the context of remote maintenance. The key for using this approach are heterogeneous integration technologies, which combines several components or functionalities with a very high degree of miniaturization and flexibility at reasonable costs in one package (system in package or SiP), that is specifically adapted to the application environments.
  • Publication
    Hetero System Integration - enabling technology for future products
    ( 2005)
    Reichl, H.
    ;
    Aschenbrenner, R.
    ;
    Pötter, H.
  • Publication
    From packaging to system integration - the paradigm shift in microelectronics
    ( 2004)
    Wolf, M.J.
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    Reichl, H.
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    Adams, J.
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    Aschenbrenner, R.
    Faced with the rapid development of IC technology the traditional packaging is merging into a complex system integration technique to satisfy the growing demand in terms of increased functionality, performance and miniaturization of electronic products. This requires the development of new packaging and system integration technologies using complex design tools along with new materials to realize complex systems in a package carrying multiple components such as silicon ICs, MEMS, sensors or optical devices. Some major aspects, challenges and requirements of system integration technologies are discussed which will be of special interest in the next years.