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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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PatentIntegration eines Chips innerhalb einer Leiterplatte und integrierte Schaltung( 2004)DE 20021698 U UPAB: 20010628 NOVELTY - The integrated circuit includes a chip (1) without casing, and with at least one contact surface area (3) on its front side. A printed circuit board is provided with a floor layer (4) which comprises a dielectric layer (5) and a conductor structure (6). The chip is attached with its rear side on the floor layer, whereby no gap is provided for the chip in the dielectric layer. A further printed circuit board layer arranged on the floor layer encloses the chip. DETAILED DESCRIPTION - Extrusions extend through the further printed circuit board layer up to the connection surface area and the conductor structure, without extending through the chip. A contacting conductor structure is arranged on the further printed circuit board layer, extending up to the connection surface area and the conductor structure. USE - Integration of chips inside printed circuit board. ADVANTAGE - Enables high integration, and manufacture with existing processes and equipment.
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PatentPapier mit integrierter Schaltung( 2000)A basic material, in particular paper, comprises an integrated circuit within the basic material, said integrated circuit comprising predetermined data which is readable by contactless means and is connected permanently to the basic material.
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PatentVisitenkarte( 1998)The visiting or business card has the size and thickness of a standard printed business card and has an integrated circuit embedded into it. The circuit is in the form of a read only memory that contains alpha numeric user information that can also represent a graphical image or photographic sequence. Audio information may also be stored. The surface of the card can be printed. USE - Electronic visiting card. ADVANTAGE - Is same size as standard printed visiting card.
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