Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Sensor Systems for Extremely Harsh Environments
    ( 2023-10-31)
    Kappert, Holger
    ;
    Schopferer, Sebastian
    ;
    Saeidi, Nooshin
    ;
    Döring, Ralf
    ;
    Ziesche, Steffen
    ;
    Olowinsky, Alexander
    ;
    Naumann, Falk
    ;
    Jägle, Martin
    ;
    Spanier, Malte
    ;
    Grabmaier, Anton
    Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean and energy efficient operation or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project ‘eHarsh’ to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are not only pure sensor elements, rather containing one or multiple sensor elements and integrated readout electronics. Various technologies which are necessary for the realization of such sensor systems have been identified, developed and finally bundled in a technology platform. These technologies are e. g. MEMS and ceramic based sensors, SOI-CMOS based integrated electronics, board assembly and laser based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization and reliability simulations. Based on the platform a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.
  • Publication
    Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration
    ( 2023)
    Lykova, Maria
    ;
    Panchenko, Juliana
    ;
    Schneider-Ramelow, Martin
    ;
    Suga, T.
    ;
    Mu, F.
    ;
    Buschbeck, R.
    Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air. This research paper describes a method of Cu passivation using a self-assembled monolayer (SAM) to protect the surface against oxidation. However, this approach faces two main challenges: the degradation of the SAM at room temperature in the ambient atmosphere and the monolayer desorption technique prior to Cu-Cu bonding. In this paper, the systematic investigation of these challenges and their possible solutions are presented. The methods used in this study include thermocompression (TC) bonding, X-ray photoelectron spectroscopy (XPS), shear strength testing, scanning electron microscopy (SEM), and energy dispersive X-ray spectroscopy (EDX). The results indicate nearly no Cu oxidation (4 at.%) for samples with SAM passivation in contrast to the bare Cu surface (27 at.%) after the storage at −18 °C in a conventional freezer for three weeks. Significant improvement was observed in the TC bonding with SAM after storage. The mean shear strength of the passivated samples reached 65.5 MPa without storage. The average shear strength values before and after the storage tests were 43% greater for samples with SAM than for the bare Cu surface. In conclusion, this study shows that Cu-Cu bonding technology can be improved by using SAM as an oxidation inhibitor, leading to a higher interconnect quality.
  • Publication
    Sensor Systems for Extremely Harsh Environments
    ( 2022-10-01)
    Kappert, Holger
    ;
    Schopferer, Sebastian
    ;
    Saeidi, Nooshin
    ;
    Döring, Ralf
    ;
    Ziesche, Steffen
    ;
    Olowinsky, Alexander
    ;
    Naumann, Falk
    ;
    Jägle, Martin
    ;
    Spanier, Malte
    ;
    Grabmaier, Anton
    Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean, and energy-efficient operation, or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project “eHarsh” to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are more than pure sensors, rather these are containing one or multiple sensing elements and integrated readout electronics. Various technologies, which are necessary for the realization of such sensor systems, have been identified, developed, and finally bundled in a technology platform. These technologies are, e.g., MEMS and ceramic-based sensors, SOI-CMOS-based integrated electronics, board assembly and laser-based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization, and reliability simulations. Based on the platform, a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.
  • Publication
    Sensor Systems for Extremely Harsh Environments
    ( 2022)
    Kappert, Holger
    ;
    Schopferer, Sebastian
    ;
    Saeidi, Nooshin
    ;
    Ziesche, Steffen
    ;
    Olowinsky, Alexander
    ;
    Naumann, Falk
    ;
    Jägle, Martin
    ;
    Spanier, Malte
    Sensors are key elements for the detection of environmental properties and are indispensable in industrial applications for process monitoring and intelligent control of processes. While highly integrated sensor systems are already state -of-theart in many everyday areas, the situation in an industrial environment is significantly different. The use of sensor systems is often not possible because the extreme environmental conditions of industrial processes such as high operating temperatures or strong mechanical loads do not allow the reliable operation of sensitive electronic components. As part of the Fraunhofer Lighthouse project eHarsh, eight institutes have bundled their competencies and created a technology platform as a basis for the development of sensor systems for extremely harsh environments.
  • Publication
    Smart sensor systems for extremely harsh environments
    ( 2021)
    Kappert, Holger
    ;
    Schopferer, Sebastian
    ;
    Döring, Ralf
    ;
    Ziesche, Steffen
    ;
    Olowinsky, Alexander
    ;
    Naumann, Falk
    ;
    Jägle, M.
    ;
    Ostmann, Andreas
    Sensors systems are key elements for capturing environmental properties and are increasingly important in industry 4.0 for the intelligent control of processes. However, under harsh operating conditions like high temperatures, high mechanic load or aggressive environments, standard electronics cannot be used. Eight Fraunhofer institutes have therefore bundled their competencies in sensors, microelectronics, assembly, board design, laser applications and reliability analysis to establish a technology platform for sensor systems working under extreme conditions.
  • Publication
    On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
    ( 2020)
    Roshanghias, A.
    ;
    Dreissigacker, M.
    ;
    Scherf, C.
    ;
    Bretthauer, C.
    ;
    Rauter, L.
    ;
    Zikulnig, J.
    ;
    Braun, T.
    ;
    Becker, K.-F.
    ;
    Rzepka, S.
    ;
    Schneider-Ramelow, M.
    Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler vibrometry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.
  • Publication
    Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
    ( 2019)
    Becker, Karl-Friedrich
    ;
    Böttcher, Mathias
    ;
    Schiffer, Michael
    ;
    Pötter, Harald
    ;
    Brockmann, Carsten
    ;
    Freimund, Damian
    ;
    Tschoban, Christian
    ;
    Windrich, Frank
    ;
    Braun, Tanja
    ;
    Hopsch, Fabian
    ;
    Heinig, Andy
    ;
    Voigt, Sven
    ;
    Baum, Mario
    ;
    Hofmann, Lutz
    ;
    Lang, Klaus-Dieter
    Diese Veröffentlichung stellt das Konzept und die dazugehörige Packaginglösung einer universellen IoT Sensorplattformmit einer System-on-Chip (SoC) Familie als zentrale Steuer- und Recheneinheit vor. Die Plattform besteht aus 4 Ebenen, die angefangen vom hochintegrierten SoC, über die Montagemöglichkeit von gehäusten wie auch ungehäusten Sensoren bis hin zum System Board, was die üblichsten drahtgebundenen und drahtlosen Schnittstellen zur Verfügung stellt. Das Layout zur Sensormontage kann auf individuelle Kundenwünsche angepasst werden, um so spezielle Anforderungen an die Messaufgabe zu ermöglichen. Die Kerntechnologie des Packages besteht aus einem Moldpackage in Fan-Out Technologiemit unterseitiger Umverdrahtung des SoC zu den Balling Pads und Durchführungen zur oberseitigen Umverdrahtungfür die Montage der Sensoren.
  • Publication
    A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
    ( 2018)
    Wunderle, B.
    ;
    May, D.
    ;
    Heilmann, J.
    ;
    Arnold, J.
    ;
    Hirscheider, J.
    ;
    Li, Y.
    ;
    Bauer, J.
    ;
    Ras, M.A.
    Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium thermal conductivities and simple application, all of which make it an alternative to solders, thermal adhesives or pads. It is widely used in power and microprocessor applications, most of which involve large areas to be used for heat transfer. However, for years thermal overload failure of power modules and chips has been a pressing problem due to pump-out of thermal grease as die or module thermal interface material (TIM): Most thermal greases are Bingham fluids and thus not solids, so they can be squeezed out from in between the gap, driven by thermo-mechanical action of the adjacent layers as e.g. DCB substrate or silicon chip with the heat sink. Today, thermal greases have to be qualified in lengthy stress tests in a product relevant environment which consumes substantial resources as often a system test is required. Therefore, a fast test is necessary which accelerates testing and thus allows a fast screening of commercial greases on one hand, and guidelines for material development on the other. For that purpose this paper addresses this topic in a combined simulative and experimental way, where at the same time a novel test procedure is proposed for accelerated grease pump-out testing (GPOT) in the framework of a completely new approach, combining loading with in-situ failure analytical techniques and decoupling thermal from mechanical loading. This allows for the first time a realistic loading of greases during accelerated testing. The method is demonstrated on various commercial and custom greases, varying their composition and structure, and benchmarked against industry standard thermal cycling tests.
  • Publication
    Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
    ( 2018)
    Rülke, Steffen
    ;
    Beyer, Volkhard
    ;
    Zorn, Wolfgang
    ;
    Meinig, Marco
    ;
    Wecker, Julia
    ;
    Reuter, Danny
    ;
    Deicke, Frank
    ;
    Clausner, André
    ;
    Werner, Thomas
    Functional integration on the micro/nano scales enables smart functionalities in mechanical engineering systems. Here, exemplarily shown for a ball screw drive, a structure-integrated wireless sensor technology is implemented into a manufacturing system for advanced process control and status monitoring - even at machine components being not yet accessible or difficult to access. This includes also a miniaturized, networked and energy-efficient information and communication technology (ICT) integrated into the machine.
  • Publication
    Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
    ( 2018)
    Wunderle, B.
    ;
    Springborn, M.
    ;
    May, D.
    ;
    Heilmann, J.
    ;
    Manier, C.-A.
    ;
    Abo Ras, M.
    ;
    Oppermann, H.
    ;
    Sarkany, Z.
    ;
    Mitova, R.
    Novel concepts in power electronics rely heavily on the availability and processability of new materials and packaging technologies to meet the requirements of increasing performance and reliability at lower form factor, weight and cost. Today's main technological route for converter modules is still the power die soldered and wire-bonded to a DCB substrate. New applications or semiconductor technologies like e.g. SiC, however, require enhanced thermal management using standard commercial casings within the same, usually very limited thermal budget. This paper is the final of a series of publications dealing with a novel thermal management concept for power electronics enabled by the use of advanced packaging technologies as well as smart handling of power transients, making use of a TEC and a thermal buffer using a low melting BiSn eutectic as phase change material to store excess heat temporarily exploiting the PCM's enthalpy of fusion. This concept is exemplified on a typical six-pack converter module for industrial applications (4 kW, 1200 Volts) to be integrated into a standard easyPIM casing while being able to cope with overload power pulses. This paper summarises the whole system approach, references back to literature for details finishes the series of papers with the reliability analysis of the buffer technology. Thus, all stages of product development covering design, technology and performance are finally highlighted.