Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Establishing ecoreliability of electronic devices in manufacturing environments
    ( 2014)
    Middendorf, Andreas
    ;
    Benecke, Stephan
    ;
    Nissen, Nils
    ;
    Wittler, Olaf
    ;
    Lang, Klaus-Dieter
    EcoReliability describes the inclusion of reliability aspects into the environmentally conscious design of electronic systems to address the originally separated domains from one mutual perspective. This paper motivates the importance of such an approach for the case of electronic products and in particular embedded electronics. Environmental analysis of electronics has often been narrowed down to energy use, but the total resource use is now seen as equally important. Using technical examples from promising applications in robust electronics for manufacturing equipment, measures in system design aiming at an increase of sustainability through determination of a truly balanced degree of reliability are presented. The first case is taken from the field of power electronics with demanding requirements towards robustness. Measures to increase the allowable number of thermal cycles during operation are compared towards shifts in environmental attributes. For the second case, miniaturized sensors are introduced that face issues of obsolescence when applied to machine tool environments in long-term scenarios.
  • Publication
    Early-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects
    ( 2014)
    Krüger, Michael
    ;
    Trampert, Stefan
    ;
    Middendorf, Andreas
    ;
    Schmitz, Stefan
    ;
    Lang, Klaus-Dieter
    Reliability of electronic systems is finally limited due to thermo-mechanical fatigue of interconnections. Besides soldered interconnections wire bonding is one of the most commonly used interconnection technology in electronics. Due to thermo-mechanical loading wire bond technology suffers from cracking in the heel region and delamination in the interface. To increase lifetime and lower ecological impact of electronic systems, a condition monitoring concept is needed, which is able to determine the remaining lifetime of an interconnection. The scope of this paper lies in the development of a parameter measurement system for early-state crack detection in the heel region of wire bond interconnections. This parameter measurement system uses signal components generated by cyclic opening and closing of growing cracks. So it becomes possible to determine the remaining lifetime of the interconnection, which is directly connected to the lifetime of the whole system. Furthermore an analytical model is presented, which supports the experimental setup. Measured cracks are investigated by metallographic cross-sectioning of wire bonds and focused ion beam (FIB).
  • Publication
    Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors
    ( 2014)
    Hahn, Daniel
    ;
    Straube, Stefan
    ;
    Abelein, Ulrich
    ;
    Middendorf, Andreas
    ;
    Lang, Klaus-Dieter
    Within the scope of electrification and challenges to offer innovative and high quality products, an original equipment manufacturer has to handle the quality of the entire system. Especially the complexity and reliability of electric/electronic systems and subcomponents need to be managed. Suppliers and their sub-suppliers have to understand the environmental and application oriented loads for their products. Therefore specific environmental and functional requirements need to be provided. In this work a holistic approach to focus knowledge and experience of every part of the supply chain to develop and cover robust semiconductors is shown.
  • Publication
    Ecodesign Requirements for servers - from single product groups to extended system approach
    ( 2014)
    Nissen, Nils F.
    ;
    Stobbe, Lutz
    ;
    Faninger, Thibault
    ;
    Berwald, Anton
    ;
    Lang, Klaus-Dieter
    The currently ongoing ENTR Lot 9 preparatory study for ecodesign of enterprise server and storage equipment raises a number of methodological questions as the investigation requirements shift further from of a pure product scope to extended system analysis. The paper will give insight into the current status of the study. However, the core part of the paper will focus on the methodological aspects of addressing ecodesign on an individual product level while at the same time reflecting the extended system. The paper will explain the ecodesign implications of the various system levels, i.e. the sub-system (IT product) and extended system (support infrastructure) relationship. We then explore the options on how to cope with extended system aspects on a product scope level. The analysis will then examine existing and needed test standards, which are especially crucial for sub-system requirements.
  • Publication
    Translating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook
    ( 2014)
    Schischke, Karsten
    ;
    Nissen, Nils
    ;
    Lang, Klaus-Dieter
    In a complex industry such as the electronics sector Life Cycle Assessments are still challenging. This holds true in particular for small and medium-sized enterprises with rarely any knowledge in LCA and limited resources to undertake comprehensive LCA studies. This paper describes the approach of the FP7 funded project LCA to go, which developed simplified online tools for SMEs to assess products from a selection of sectors on their own. The webtools build on embedded LCA data models and a translation of environmental impacts (Key Environmental Performance Indicators) into the technical terms found typically in the specification of computer products. As this spec has to be defined by a computer assembler anyway, he is aware of almost all the required entry data. This approach is demonstrated by establishing 3 benchmark laptop products, which can be used by SMEs to compare own designs with conventional laptops. Chosen benchmarks are a netbook, a consumer laptop 15,6? and a business ultrabook 14?. The paper outlines the methodology and shows quantified results for these 3 benchmark products. Some remaining challenges will be discussed, such as product lifetime and modelling end-of-life. This approach is not intended to replace a detailed LCA or carbon footprint study compliant with ISO 14040 or 14067, but has to be understood as an entry-level for SMEs to Life Cycle Assessments.
  • Publication
    Tablet PCs through the lens of environment - design trends and impacts on the environmental performance
    ( 2014)
    Dimitrova, Gergana
    ;
    Nissen, Nils
    ;
    Stobbe, Lutz
    ;
    Schlösser, Alexander
    ;
    Schischke, Karsten
    ;
    Lang, Klaus-Dieter
    The mobile IT market is seeing a significant growth in the tablet PC shipments. The high sales numbers combined with potential short use and complex design lead to concerns about tablets? environmental relevance. In this respect, it is of specific interest to assess the environmental performance of tablets, comprising the evaluation of the design solutions with regard to repair and recycling as well as the identification of the environmentally relevant life cycle phases. 21 tablet models have been disassembled and compared in terms of non-destructive opening for repair purposes and partly destructive dismantling for end-of-life scenarios. Furthermore, an assessment of the environmental impacts associated with tablets in comparison with netbooks has been carried out. The modelling is performed using the LCA to go tool. In addition, using X-Ray Fluorescence spectrometry, the paper examines the content of critical raw materials in selected components. Quantified results from the assessments are presented.
  • Publication
    Design Features of Current Tablet Computers to Facilitate Disassembly and Repair
    ( 2013)
    Nissen, Nils F.
    ;
    Stobbe, Lutz
    ;
    Oerter, Markus
    ;
    Scheiber, Sascha
    ;
    Schlösser, Alexander
    ;
    Schischke, Karsten
    ;
    Lang, Klaus-Dieter
    Tablet computers (or slates) are a tremendously growing market and are increasingly encroaching on the traditional desktop and laptop sales. The high sales numbers combined with potentially short use times lead to concerns about whether tablets can be disassembled easily for recycling or - before that ultimately becomes necessary - for repair. Several current tablet models have been disassembled to support this study and are compared in terms of non-destructive opening for repair purposes and partly destructive disassembly for end-of-life scenarios. Examples from the disassembly are examined in terms of the connection types used and the tools needed for a high quality disassembly. Without a deeper life cycle view the analysis should not be understood to pinpoint a 'new' major environmental problem, but to deliver specific facts and observations.
  • Publication
    Moisture induced swelling in epoxy moulding compounds
    ( 2013)
    Walter, Hans
    ;
    Hölck, Ole
    ;
    Dobrinski, Heiko
    ;
    Stuermann, J.
    ;
    Braun, Tanja
    ;
    Bauer, Jörg
    ;
    Wittler, Olaf
    ;
    Lang, Klaus-Dieter
    Microelectronic components are introduced to an increasing number of applications as part of a controlling or monitoring device, as sensors or as means to tracking. Depending on the application, extreme loading profiles may need to be endured such as high temperatures, random vibrations or humid and even wet environments. Absorbed moisture has a plasticizing effect on the physical properties of polymers. Furthermore, moisture leads to corrosion of metallic parts of the devices and therefore molding compounds are used to protect sensible electronics. However, the epoxy matrix of the molding compounds tends to absorb water molecules and subsequently exhibits a swelling behavior which is unique to the chemistry of the epoxy. Since most other materials involved do not swell when exposed to moisture, a stress between the materials is induced which is similar in origin (dimensional change in materials) and magnitude as the thermal mismatch induced stresses or chemical shrinkage. It is important to know both absorption and desorption properties of used epoxy systems. This paper represented results of moisture diffusion in different high filled epoxy molding compounds using two parallels analysis methods - Thermo Gravimetric Analyzer (TGA) and Thermal Mechanical Analyzer (TMA) at different loading conditions. TGA as a commonly measurement method for analysis of in-situ weight changing due to moisture absorption and desorption. Thermal Mechanical Analyzer was coupled with a conventional humidity generator to be able to in-situ measure the swelling strain of the sample. The enhanced TMA-technique can be used for measuring the dimensional changes of specimens as a function of variable temperature and humidity. The results can be used for integrated finite element analysis methodology, which couples the transient moisture diffusion and the hygroscopic swelling with temperature range.