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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
Compact Wideband Antenna-in-Package Based on PCB Technology for 39 GHz 5G mmWave Applications
High Density Thin Film Flex Technology for Advanced Packaging Applications
Embedded Power GaN Components inside a PCB for space applications