Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    A highly flexible design and production framework for modularized microelectromechanical systems
    ( 1998)
    Schünemann, M.
    ;
    Grosser, V.
    ;
    Leutenbauer, R.
    ;
    Bauer, G.
    ;
    Schäfer, W.
    ;
    Reichl, H.
    A highly flexible modular design and production framework for microelectromechanical systems, suitable for midscale production at reasonable costs is introduced. The modular framework consists of a manufacturer set and an application kit. It allows for considerable reduction of design and production expenditure whilst retaining maximum technical flexibility. A novel vertical integration technique (TB2GA) for the realization of modular microelectromechanical systems is presented. Development and standardization of homogeneous mechanical, optical, information, power supply and media interfaces are discussed. The feasibility of the modular approach is demonstrated by the realization of modular microsystems combining TB2GA multimodule stacks, interfaces, plugs, and enclosure.
  • Publication
    The Development of a Top-Bottom-BGA (TB-BGA)
    ( 1998)
    Leutenbauer, R.
    ;
    Grosser, V.
    ;
    Schünemann, M.
    ;
    Reichl, H.
    A "Top Bottom Ball Grid Array" (TB-GBA) is described, that takes advantage of existing BGA and CSP techniques, to create a new package for SCMs, MCMs, sensors and actuators. By using a pin-compatible BGA configuration at the bottom and the top of the carrier, a 3D stack assembly of several TB-BGAs is possible. As demonstrators ceramic TB-BGAs are actually developed as single chip modules (SCMs) and multichip modules (MCMs). They will be mounted as intelligent sensors bus interfaces in convetional sensor casings. A full operating 16-bit-processor-unit including microcontroller, SRAM, EEPROM, CAN bus interface, oscillator and SMD components will require a volume of only 1.2 cmü.
  • Publication
    Modularization of Microsystems and Standardization of Interfaces
    ( 1998)
    Schünemann, M.
    ;
    Bauer, G.
    ;
    Schäfer, W.
    ;
    Leutenbauer, R.
    ;
    Grosser, V.
    ;
    Reichl, H.
    Smart sensors, actuators and control systems fitting into distributed control architectures have been identified as the main applications of microelectromechanical systems in industrial areas like machinery and plant manufacturing, production control, power systems, and home and building control. However, their present use is restricted by the insufficient availability of customer-adapted microsystems in medium-scale units at market-acceptable cost. A flexible modular design and production framework for microelectromechanical systems allows for the distributed design and production of MEMS modules. The modular approach enables the economically efficient design and medium-scale production of customer-adapted smart microsystems. Since the definition of interfaces between the system has to be precise and complete, the initialization of a standardization process is indispensable.