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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Advancements in bumping technologies for flip chip and WLCSP packaging
Stretchable electronic systems: Realization and applications
Embedding technology development for a 77 GHz automotive radar system
Large area embedding for heterogeneous system integration
Innovative package realization by Chip Embedding Technologies
Embedded Chip Packages Technology and Applications
Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Stretchable circuit board technology in textile applications
Biocompatible lab-on-substrate technology platform