Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    On the crack and delamination risk optimization of a Si-interposer for LED packaging
    ( 2014)
    Auersperg, J.
    ;
    Dudek, R.
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    Jordan, R.
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    Bochow-Neß, O.
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    Rzepka, S.
    ;
    Michel, B.
    3D-integration becomes more and more an important issue for advanced LED packaging solutions as it is a great challenge for the thermo-mechanical reliability to remove heat from LEDs to the environment by heat spreading or specialized cooling technologies. Thermal copper-TSVs provide an elegant solution to effectively transfer heat from LED to the heat spreading structures on the backside of a substrate. But, the use of copper-TSVs generates also novel challenges for reliability as well as also for reliability analysis and prediction, i.e. to manage multiple failure modes acting combined - interface delamination, cracking and fatigue, in particular. In this case, the thermal expansion mismatch between copper and silicon yields to risky stress situations. To overcome cracking and delamination risks in the vicinity of thermal copper-TSVs the authors performed extensive simulative work by means of fracture mechanics approaches - an interaction integral approach within a simulative DoE and the X-FEM methodology to help clarifying crack propagation paths in silicon. The results provided a good insight into the role of model parameters for further optimizations of the intended thermal TSV-approaches in LED packaging applications.
  • Publication
    Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
    ( 2011)
    Hölck, O.
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    Dermitzaki, E.
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    Wunderle, B.
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    Bauer, J.
    ;
    Michel, B.
    In this work we present a procedure for the construction of 3D networked epoxy moulding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations. Our investigations present part of general trend to extend failure analysis, reliability assessment and the development of packaging materials from the conventional discrete usage of simulation techniques to a more holistic approach of an interconnected multimethods- procedure, enabling bottom-up simulation of complex microsystems. Within that framework, the task at hand for detailed atomistic molecular modelling is to develop practical methods in order to take materials development as well as materials failure analysis to the nanoscale level. This paper reports a cross linking scheme for the construction of three dimensionally cross linked simulation packages and presents a first property analysis of an industry-oriented moulding compound material. First models and results are presented of model packages of ideal epoxy/silicon-dioxide interfaces.
  • Publication
    Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
    ( 2009)
    Michel, B.
    ;
    Dudek, R.
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    Auersperg, J.
    ;
    Winkler, T.