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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Hotspot-optimized interlayer cooling in vertically integrated packages
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Heat-removal performance scaling of interlayer cooled chip stacks
Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Zerstörungsfreie Beobachtung von Rissen in Leiterplattendurchkontaktierungen - Quantisierung der Risslänge mittels Impulsthermographie und FEM-Simulation
Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading