Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
    ( 2014)
    Ndip, I.
    ;
    Zoschke, K.
    ;
    Löbbicke, K.
    ;
    Wolf, M.J.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    ;
    Henke, H.
    In this paper, analytical, numerical-, and measurement-based methods for extracting the resistance, inductance, capacitance, and conductance of through silicon vias (TSVs) are classified, quantified, and compared from 100 MHz to 100 GHz. An in-depth analysis of the assumptions behind these methods is made, from which their limits of accuracy/validity are defined. Based on this, the most reliable methods within the studied frequency range are proposed. The TSVs are designed, fabricated, and measured. Very good correlation is obtained between electrical parameters of the TSVs extracted from the measurements and electromagnetic field simulations.
  • Publication
    Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
    ( 2013)
    Ndip, I.
    ;
    Bierwirth, M.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    In this contribution, an interconnected patch ring (IPR) structure for noise suppression in the cavity of power-ground plane pairs is designed, fabricated and measured. The impact of electromagnetic interactions between an integrated/embedded IPR and power/ground planes in electronic packages and printed circuit boards is extensively studied. Our results reveal that the presence of a metal layer (i.e., a power/ground plane) above an IPR causes the excitation of parallel-plate modes and undesired coupling, which leads to the disappearance of the stopband of the IPR. Design methods to prevent this disappearance are investigated.
  • Publication
    Modeling and minimizing the inductance of bond wire interconnects
    ( 2013)
    Ndip, I.
    ;
    Öz, A.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    ;
    Henke, H.
    In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in dependent on bonding parameters such as loop height, distance between bonding positions and the thickness of the metallization on which the wire is bonded, is derived for the first time. An excellent correlation is obtained between inductances extracted using our proposed model and those extracted using Ansys Q3D, with a maximum deviation of approximately 1%. Furthermore, methods for minimizing the inductance of bond wires, based on the definitions of loop and partial inductances are discussed. Test bond wire structures are designed, fabricated and measured to quantify the implemented method.
  • Publication
    Systematic design and optimization of bond wire antennas using the M3-approach
    ( 2012)
    Ndip, I.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.D.
    In this paper, all the three steps required for implementing the M3-approach are illustrated for bond wire antennas. First, a methodology for efficient and accurate electromagnetic modeling of bond wire antennas, based on parameterized models of the shape and length of bond wires, is developed. The resulting model is experimentally verified and applied to extensively study the RF performance of bond wire antennas. Based on these studies, reliable design measures are derived.
  • Publication
    Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
    ( 2012)
    Ndip, I.
    ;
    Öz, A.
    ;
    Tschoban, C.
    ;
    Schmitz, S.
    ;
    Schneider-Ramelow, M.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especially onchip planar antennas), they have received much research attention within the last four years. The focus of the contributions made so far has been on exploiting different configurations of single-element and array bond wire antennas for short-range applications at RF/microwave frequencies. However, the effects of process tolerances of bond wires on the radiation characteristics of bond wire antennas have not been studied in published literature. Therefore in this paper, we investigate the impact of up to 20% fluctuations in the parameters of bond wires on the performance of 42 GHz and 60 GHz bond wire antennas. Our results reveal that the length and radius of bond wires are the most and least sensitive parameters, respectively. Furthermore, the severity of the impact of process tolerances depends on the impedance bandwidth of the original antenna, before considering the tolerances. For example, a 10% change in the length of a bond wire causes the resonance frequency of a 42 GHz antenna to be shifted out of the specified 3GHz bandwidth (40.5 GHz-43.5 GHz) required for point-to-point communication. However, although a 10% change in length of a bond wire yields a 2.5 GHz shift in the resonance frequency of a 60 GHz bond wire antenna, it doesn't completely detune the antenna because of the original 6 GHz bandwidth available, prior to the fluctuation. Therefore, to prevent the impact of process tolerances from severely degrading the performance bond wire antennas, these antennas should be designed to have larger bandwidths than specified. For experimental verification, a bond wire antenna was designed, fabricated and measured. Very good correlation was obtained between measurement and simulation.
  • Publication
    Characterization of interconnects and RF components on glass interposers
    ( 2012)
    Ndip, I.
    ;
    Töpper, M.
    ;
    Löbbicke, K.
    ;
    Öz, A.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    As a result of their myriad of advantages over silicon and other conventional substrate technologies, glass substrates have received significant attention from the electronic packaging and system integration community worldwide. So far, most of the research effort on glass has concentrated on developing methods for fabricating cylindrical through glass vias (TGVs). However, to fully evaluate the potential of glass as an interposer material for microelectronic systems with computing and communication functions, an extensive characterization of interconnects and RF components on these substrates must be carried out. In this contribution, we go beyond state-of-the-art research and present an in-depth characterization of TGVs, coplanar lines and 60 GHz coplanar excited patch antennas on two glass substrates. One of these substrates has a low alkaline content (Borofloat33®) and the other is alkaline-free (AF32®). The effects of these glass materials on the RF performance of TGVs, coplanar lines and 60 GHz antennas are extensively studied, and recommendations for performance optimization are proposed. For experimental verification, test samples are fabricated and measured. Very good correlation is obtained between the measurement and simulation results from 100 MHz to 100 GHz.
  • Publication
    Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
    ( 2012)
    Ndip, I.
    ;
    Lobbicke, K.
    ;
    Zoschke, K.
    ;
    Guttowski, S.
    ;
    Wolf, J.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    Closed-form expressions and numerical/measurement-based methods for extracting the inductance (L) and capacitance (C) of Through Silicon Vias (TSVs) are analyzed and compared for frequencies up to 40 GHz. The discrepancies between the methods are discussed. The TSVs are designed, fabricated and measured. Good correlation is obtained between L and C values of TSVs extracted from RF measurements and electromagnetic field simulations.
  • Publication
    Modelling the shape, length and radiation characteristics of bond wire antennas
    ( 2012)
    Ndip, I.
    ;
    Oz, A.
    ;
    Tschoban, C.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.D.
    ;
    Henke, H.
    Novel analytical models for accurately modelling the shape and length of bond wires in dependence on the loop height (Lh(max)), distance between the bonding positions (d(bp)) and the thickness of the metallisation (t(met.)) on which the wires are bonded, are derived in this work. These analytical models, which are based on the Gaussian distribution function, are applied to (i) develop realistic three-dimensional electromagnetic models of bond wire antennas and study their radiation characteristics and (ii) study the impact of process tolerances of bond wire parameters on the performance of the antennas. For these studies, a 42 GHz half-loop bond wire antenna is considered as an example. It is designed, fabricated and measured. Our results reveal that dbp has the most significant impact on the antenna performance. For example, -10% fluctuations in dbp causes similar to 2.5 GHz shift in the resonance frequency and 24% reduction in the maximum realised gain. Since this may completely detune the antenna, it is recommended that fluctuations in d(bp) should be kept below 10% during the manufacturing process. Good correlation is obtained between measurement and simulation results.
  • Publication
    Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
    ( 2012)
    Ndip, I.
    ;
    Öz, A.
    ;
    Tschoban, C.
    ;
    Schmitz, S.
    ;
    Schneider-Ramelow, M.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especially on-chip planar antennas), they have received much research attention within the last Jour years. The Jocus oj the contributions made so Jar has been on exploiting different configurations oj single- element and array bond wire antennas Jor short-range applications at RF/microwave jrequencies. However, the effects of process tolerances of bond wires on the radiation characteristics of bond wire antennas have not been studied in published literature. Therefore in this paper; we investigate the impact of up to 20% fluctuations in the parameters of bond wires on the performance of 42 GHz and 60 GHz bond wire antennas. Our results reveal that the length and radius of bond wires are the most and least sensitive parameters, respectively. Furthermore, the severity of the impact of process tolerances depends on the impedance bandwidth of the original antenna, before consideri ng the tolerances. For example, a 10% change in the length of a bond wire causes the resonance frequency of a 42 GHz antenna to be shifted out of the specified 3GHz bandwidth (40.5 GHz-43.5 GHz) required for point-to-point communication. However, although a 10% change in length of a bond wire yields a 2.5 GHz shift in the resonance frequency of a 60 GHz bond wire antenna, it doesn't completely detune the antenna because of the original 6 GHz bandwidth available, prior to the fluctuation. Therefore, to prevent the impact of process tolerances from severely degrading the performance bond wire antennas, these antennas should be designed to have larger bandwidths than specified. For experimental verification, a bond wire antenna was designed, jabricated and measured. Very good correlation was obtained between measurement and simulation.
  • Publication
    Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
    ( 2011)
    Ndip, I.
    ;
    Tschoban, C.
    ;
    Schmitz, S.
    ;
    Ostmann, A.
    ;
    Schneider-Ramelow, M.
    ;
    Guttowski, S.
    ;
    Reichl, H.
    ;
    Lang, K.-D.
    In this contribution, the authors present a systematic approach for optimizing the RF performance of bond wires. First of all, a comparative analysis between two of the most commonly used bond wire signal configurations, the two conductor and coplanar configurations, is done. Their results reveal that although the partial self-inductance of the signal wires is the same in both configurations, the partial mutual inductance of the coplanar configuration is higher, resulting in a smaller loop inductance. Consequently, the return and insertion losses are smaller. By reducing the distance between the signal and return currents, they further reduced the loop inductance, and significantly optimized the coplanar configuration. For example, considering a 1 mm long bond wire with a diameter of 25 micron, they successfully kept the power lost through the coplanar configuration below 10 % at 15 GHz, in comparison to the 70 % power lost through the two-conductor configuration at the same frequency. However, more than 30 % of the entire power is lost through the optimized coplanar configuration at 40 GHz. At such frequencies where bond wires are unsuitable to be used as transmission lines, they demonstrate that they are very efficient as antennas by designing a half-loop integrated bond wire antenna having a bandwidth of 3 GHz. For experimental verification, test samples were designed, fabricated and measured. An excellent correlation was obtained between simulation and measurement.