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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Coupled electro-thermo-mechanical analyses on power cycling induced loadings in sintered silver IGBT-modules with and without overmolding
Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Solder joint reliability in automotive applications: Describing damage mechanisms through the use of EBSD
Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Simulation based analysis of secondary effects on solder fatigue